Job Summary:
As a Staff Reliability Engineer, you will be responsible for defining, implementing, and overseeing reliability strategies to ensure the performance and robustness of our MEMS products. You will work closely with cross-functional teams, including design, process, test, and quality engineering, to drive reliability improvements and compliance with industry standards and customer requirements.

Key Responsibilities:

• Develop and execute reliability test plans for MEMS semiconductor devices, ensuring compliance with JEDEC, AEC-Q100, and other industry standards.
• Lead failure analysis (FA) investigations, identify root causes, and implement corrective and preventive actions (CAPA).
• Oversee accelerated life testing, including HTOL, ELFR, THB, HAST, TC, and mechanical stress tests for MEMS devices.
• Collaborate with design, process, and product engineers to enhance reliability performance in new product development (NPD).
• Define DFR (Design for Reliability) strategies, including physics-of-failure (PoF) modeling, material selection, and reliability risk assessment.
• Manage reliability qualification plans for new products and process changes.
• Interface with customers, suppliers, and external partners on reliability requirements and technical discussions.
• Drive continuous improvement initiatives to enhance product robustness, reduce failures, and optimize test methodologies.
• Maintain reliability data, generate technical reports, and present findings to stakeholders.
• Ensure compliance with ISO 9001, IATF 16949, and other quality management system (QMS) standards.

Required Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
• 8+ years of experience in reliability engineering within the semiconductor or MEMS industry.
• Strong knowledge of MEMS device physics, packaging, and failure mechanisms.
• Hands-on experience with reliability testing methods, data analysis, and statistical tools (e.g., JMP, Minitab, Weibull analysis).
• Familiarity with FA techniques such as FIB, SEM, TEM, X-ray, and EDX.
• Experience with automotive reliability standards (AEC-Q100/Q101), consumer electronics, or industrial MEMS applications.
• Proven leadership skills with experience in managing teams or leading technical projects.
• Strong communication skills to interface with internal teams, customers, and external partners.

Preferred Qualifications:

• Ph.D. in reliability engineering, semiconductor physics, or MEMS technology.
• Background in high-volume manufacturing (HVM) reliability challenges.
• Knowledge of semiconductor fabrication processes and their impact on reliability.