The Opportunity

Work within cross functional teams to providing leadership in the areas of package design, packaging materials selection, and package assembly. You will be expected to explore new materials and new assembly methods in areas of MEMS packaging. The scope of work will include evaluation of design robustness, drawing technical conclusions, making appropriate recommendations to ensure the product conforms to engineering design intent, assembling prototypes, performing experimental testing, analyzing results in conjunction with statistics, tolerance analysis, FMEA. The job will involve very close interaction with assembly manufacturing houses, close collaborations with MEMS design, Quality, Reliability, Test and Product teams, interactions with suppliers and external customers. 

Position Qualifications:

• MS or Ph.D. in Mechanical Engineering, Materials Science, Physics, or similar disciplines.
• Broad material and fabrication knowledge and 5+ years of assembly process development experience in microelectronics
• Knowledge of assembly processes, such as wafer grinding, dicing, die attach, die stacking with thin die, flip-chip, wire bond, encapsulation, underfill, molding, ball attach, gels for environmental protection, singulation. Open-cavity packaging experience is a plus.
• Knowledge of JEDEC standards for package level integrity/reliability stress tests requirements.
• 5+ years of experience with LGA, QFN, WLCSP, and flip-chip packages.  Knowledge of substrate & lead-frame materials, as well as manufacturing, is a plus.
• 5+ years of experience in supplier/OSAT managements, NPI, and HVM including quality improvements and technology-driven cost reduction.
• Working knowledge of statistical process control and statistical tolerance analyses
• Capably address die/package interaction stress issues
• Knowledge of MEMS devices (e.g., accelerometer, gyrometer)
• Familiarity with computational FEM techniques for thermal and mechanical analysis and how they can be leveraged in package design and risk assessments
• Expert in problem-solving/troubleshooting, and providing a solution
• Ability to work in a fast-paced international environment
• Strong communication and presentation skills
• Good knowledge of  English.